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Telecommunication Components

 
blank Digital Audio Data Transformer
Description: Telecommunication Components.
Applications: For use with crystal semiconductor CS8401 & CS8402. Fast rise time compatible with standards. Through-hole and surface mount packages.
Primary Inductance: 2.5 mH ±20%.
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blank ISDN S-Interface 6 Pin, 7 Pin, 8 Pin DIP
Description: Telecommunication Components.
Applications: Through-hole single. Meets the pulse waveform template of CCITT 1.430 when recommended transformer and chip pair is used. Excellent longitudinal balance. 2K Vrms or higher voltage isolation.
OCL Pri: 22mH Min.
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blank ISDN S-Interface 16 Pin DIP
Description: Telecommunication Components.
Applications: Through-hole dual. Meets the pulse waveform template of CCITT 1.430 when recommended transformer and chip pair is used. Excellent longitudinal balance. 2K Vrms isolation.
Click to view spec
 
blank T1-CEPT-ISDN-PRI 10 Pin Dip
Description: Telecommunication Components.
Applications: Certified for heavy insulation per EN 41003/EN 60950. For T1/CEPT line interfaces. 3K Vrms isolation. Matched to leading transceiver ICs. Designed to meet ITU-T G.703.
Operating Temperature: 0°C to +70°C.
Cw/w (Max.): 18pF ~ 30pF
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blank T1/CEPT/ISDN-PRI (SMD) Small Size
Description: Telecommunication Components.
Applications: Small outline surface mount package. Dual package contains both transmit and receive transformers. Models matched to Leading Transceiver ICs.
Operating Temperature: 0°C to +70°C.
Isolation: 1500 Vrms
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